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Solder Extraction Tip

IP.com Disclosure Number: IPCOM000044394D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Flavin, EA: AUTHOR [+3]

Abstract

Electronic circuit boards are populated with spring-contact connectors which are inserted into plated through holes (PTHs) and then soldered into place. The solder is applied to the wire side of the board and flows into each PTH, securing the spring connector and creating a solder fillet around the base of each. The solder fillets often become excessive and do not meet specifications. An excessive solder fillet will reduce spring flexibility of connectors and inhibit carrier housings from seating properly, as shown in Fig. 1. A previous repair alternative was to chisel the fillet away with a sharp hand tool. This method proved not only time consuming but a high risk in connector damage. The only other recourse was to scrap the product. A new repair technique incorporates a solder-extraction device and a unique tip design.

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Solder Extraction Tip

Electronic circuit boards are populated with spring-contact connectors which are inserted into plated through holes (PTHs) and then soldered into place. The solder is applied to the wire side of the board and flows into each PTH, securing the spring connector and creating a solder fillet around the base of each. The solder fillets often become excessive and do not meet specifications. An excessive solder fillet will reduce spring flexibility of connectors and inhibit carrier housings from seating properly, as shown in Fig. 1. A previous repair alternative was to chisel the fillet away with a sharp hand tool. This method proved not only time consuming but a high risk in connector damage. The only other recourse was to scrap the product. A new repair technique incorporates a solder-extraction device and a unique tip design. The solder-extraction tip is specifically designed to access the excessive fillets. The following characteristics are realized: 1) The internal diameter is large enough to provide adequate vacuum for solder removal. 2) The outside diameter is thin enough to fit between connectors without damage to them. 3) The tip has to be angled so that it can approach the board surface vertically while the tool is hand held horizontally (Fig. 2). The tool is used in conjunction with a microscope so sufficient clearance must be maintained. (Conventional tips require the entire tool to be used perpendicular to the work surface, eliminating...