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Cooling Assembly for Solder-Bonded Semiconductor Devices

IP.com Disclosure Number: IPCOM000044395D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Horvath, JL: AUTHOR

Abstract

In this cooling assembly heat is transferred from the backside of a semiconductor device to a cold plate or heat fin arrangement through a low melting solder alloy that has been melted to provide better conformance to the backside of the device. In this assembly semiconductor devices 10 solder bonded to a substrate 12 are enclosed by cap 14. Cap 14 has a fin assembly 15 secured to the top surface, and is bonded to substrate 12 by a suitable seal 18. I/O pins 20 are bonded to the bottom side of substrate 12 and connections are made between the devices either by an internal metallurgy system, as in multilayer ceramic substrates, or by pins that extend through the substrate and make contact to a surface fan-out layer.

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Cooling Assembly for Solder-Bonded Semiconductor Devices

In this cooling assembly heat is transferred from the backside of a semiconductor device to a cold plate or heat fin arrangement through a low melting solder alloy that has been melted to provide better conformance to the backside of the device. In this assembly semiconductor devices 10 solder bonded to a substrate 12 are enclosed by cap 14. Cap 14 has a fin assembly 15 secured to the top surface, and is bonded to substrate 12 by a suitable seal 18. I/O pins 20 are bonded to the bottom side of substrate 12 and connections are made between the devices either by an internal metallurgy system, as in multilayer ceramic substrates, or by pins that extend through the substrate and make contact to a surface fan-out layer. Cap 14 has, in the top surface, an annular groove configuration 16 located directly above the devices 10 on substrate 12. Preform 22, formed of a low melting solder with a melting point in the range of 105 to 180OEC, is seated in groove 16 and is surrounded by a thin flexible preformed thin sheet of polymer (preferably polyimide) 24. A thin layer of thermal grease or oil or low melting solder film 26 is positioned between the film 24 and device 10 to form an interface having a low thermal resistance. In fabricating the aforedescribed structure the preforms 22 are machined or cast in one piece out of the desired solder alloy. The preforms are fitted into the annular grooves 16, and the sheet 26 is...