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Polyimide Adhesion to Pre-Treated Silicon Nitride Surfaces

IP.com Disclosure Number: IPCOM000044478D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Holland, KL: AUTHOR [+2]

Abstract

Hexamethyldisilazane (HMDS) is used as an adhesion promoter for certain resists on silicon nitride surfaces. Stripping the resist does not remove the HMDS, and this results in poor adhesion between the new adhesion promoting material and the subsequently deposited polyimide. The surface treatment technique is designed to allow the use of high performance resists, which require adhesion promoters, without sacrificing adhesion of subsequently deposited thin films. A KOH dip or an 02 plasma pre-treatment has been discovered to modify the HMDS treated surface and thus enhance adhesion of the coupling agent and the thin dielectric film polyimide. Both wet and dry treatments act to form inorganic hydroxides or oxides that are later hydrolized.

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Polyimide Adhesion to Pre-Treated Silicon Nitride Surfaces

Hexamethyldisilazane (HMDS) is used as an adhesion promoter for certain resists on silicon nitride surfaces. Stripping the resist does not remove the HMDS, and this results in poor adhesion between the new adhesion promoting material and the subsequently deposited polyimide. The surface treatment technique is designed to allow the use of high performance resists, which require adhesion promoters, without sacrificing adhesion of subsequently deposited thin films. A KOH dip or an 02 plasma pre-treatment has been discovered to modify the HMDS treated surface and thus enhance adhesion of the coupling agent and the thin dielectric film polyimide. Both wet and dry treatments act to form inorganic hydroxides or oxides that are later hydrolized. The KOH or 02 plasma treatment also enhances the surface wettability, making the adhesion promoter come into more rapid and intimate contact with the silicon.

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