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Planarization of Organic Coatings by Directing a Milling Ion Beam on the Surface at an Acute Angle

IP.com Disclosure Number: IPCOM000044492D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Aliotta, CF: AUTHOR [+5]

Abstract

Multilayered structures using polyimide or similar coatings as insulators and having wiring and or channels imbedded below the surface result in a disturbed or waved surface. This type of surface is undesirable for reasons such as variations in capacitance and inductances between the various elements and having a detrimental effect as well on the resolution of wiring or devices fabricated on top of the surface. This problem is caused during fabrication of the insulating layer by the surface tension of the organic coating deposited in the liquid form over an irregular topography. Subsequent layers of the organic coating have the tendency to accentuate these defects. In order to alleviate this problem it is essential to remove or reduce these imperfections at an early stage without damage to the structure.

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Planarization of Organic Coatings by Directing a Milling Ion Beam on the Surface at an Acute Angle

Multilayered structures using polyimide or similar coatings as insulators and having wiring and or channels imbedded below the surface result in a disturbed or waved surface. This type of surface is undesirable for reasons such as variations in capacitance and inductances between the various elements and having a detrimental effect as well on the resolution of wiring or devices fabricated on top of the surface. This problem is caused during fabrication of the insulating layer by the surface tension of the organic coating deposited in the liquid form over an irregular topography. Subsequent layers of the organic coating have the tendency to accentuate these defects. In order to alleviate this problem it is essential to remove or reduce these imperfections at an early stage without damage to the structure. This can be done after deposition and proper curing of the film by exposing the substrate in question to an oxygen ion beam in an oxygen-rich atmosphere. Best results are achieved by mounting the sample on a rotating holder in the chamber and where the incidence of the ion beam to the surface in question is at a very low (acute) angle, essentially only hitting the highest points on the substrate. These points will act as shields or masks to the rest of the surface until such time when all the high spots have been removed and at which point the substrate surface woul...