Browse Prior Art Database

Raw Card Heat Transfer Method

IP.com Disclosure Number: IPCOM000044528D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

LaCourse, MM: AUTHOR

Abstract

Directly mounting heat-dissipating power components onto a printed circuit board (PCB) provides a direct heat flow path from these components through a plated thru hole. This method achieves heat dissipation without directly mounting components to a heat sink device and the need to subsequently wire these components into the circuit. The method is as follows: 1. Etch the PCB 11 (raw card) to leave copper on the front and back 12 under R1, R2 and TX 13. 2. Drill the PCB 11 in the component mounting positions 14. These holes will be plated thru holes when the raw card process is completed. 3. Fasten the PCB 11 to the heatsink 15 with the heat transfer spacer block 16 which is sandwiched between the heatsink 15 and the PCB 11.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Raw Card Heat Transfer Method

Directly mounting heat-dissipating power components onto a printed circuit board (PCB) provides a direct heat flow path from these components through a plated thru hole. This method achieves heat dissipation without directly mounting components to a heat sink device and the need to subsequently wire these components into the circuit. The method is as follows: 1. Etch the PCB 11 (raw card) to leave copper on the front and back 12 under R1, R2 and TX 13. 2. Drill the PCB 11 in the component mounting positions 14. These holes will be plated thru holes when the raw card process is completed. 3. Fasten the PCB 11 to the heatsink 15 with the heat transfer spacer block 16 which is sandwiched between the heatsink 15 and the PCB 11. The heat transfer is from the front copper surface, through the plated thru holes 14, to the back copper surface, and through the heat transfer spacer block 16 to the sink 15. The heat dissipating power components can now be handled like other components for assembly and test in manufacturing.

1

Page 2 of 2

2

[This page contains 4 pictures or other non-text objects]