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Burn-In Fixture for Modules

IP.com Disclosure Number: IPCOM000044552D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 86K

Publishing Venue

IBM

Related People

Brzyski, R: AUTHOR [+4]

Abstract

A method to burn in modules, which is designed to integrate with the present cooling system and also to regulate the chip temperature for burn-in conditions, uses the burn-in fixture which is described as follows: a blower 1 provides air to the individual nozzles 2 via the entry chamber 3 for cooling the modules 4. To regulate the temperature of the chips in the modules, flow restrictors 5 (e.g., perforated screens, wire mesh screens, etc.) are mounted on the nozzles 2, thus controlling the amount of airflow through the nozzles to the designed value. Each flow restrictor is customized in terms of the percent opening for a given location and airflow for each module. The flow restrictors can be quickly changed for different burn-in test temperatures.

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Burn-In Fixture for Modules

A method to burn in modules, which is designed to integrate with the present cooling system and also to regulate the chip temperature for burn-in conditions, uses the burn-in fixture which is described as follows: a blower 1 provides air to the individual nozzles 2 via the entry chamber 3 for cooling the modules 4. To regulate the temperature of the chips in the modules, flow restrictors 5 (e.g., perforated screens, wire mesh screens, etc.) are mounted on the nozzles 2, thus controlling the amount of airflow through the nozzles to the designed value. Each flow restrictor is customized in terms of the percent opening for a given location and airflow for each module. The flow restrictors can be quickly changed for different burn-in test temperatures.

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