Browse Prior Art Database

Conduction Cooling for Pc Cards

IP.com Disclosure Number: IPCOM000044583D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

York, JP: AUTHOR

Abstract

Conduction cooling for printed circuit cards is accomplished by way of thermal dissipation in the frame environment by attaching a heatsink strap from a "hot" module mounted on a card, to the card itself, by a non-removable screw rather than to the machine frame, requiring more disassembly when removing the cards. Cards are held in the box by means of a physical support that is attached to the card by rivets or screws and is bolted to the back frame 11. By conducting the heat through a strap to that support, the module temperature is reduced. The improvement here is in the attachment of the conduction bands or thermal straps to the card support itself not to the machine frame. The screw 12 must be non-removable to ensure good thermal conduction to the frame.

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Conduction Cooling for Pc Cards

Conduction cooling for printed circuit cards is accomplished by way of thermal dissipation in the frame environment by attaching a heatsink strap from a "hot" module mounted on a card, to the card itself, by a non-removable screw rather than to the machine frame, requiring more disassembly when removing the cards. Cards are held in the box by means of a physical support that is attached to the card by rivets or screws and is bolted to the back frame 11. By conducting the heat through a strap to that support, the module temperature is reduced. The improvement here is in the attachment of the conduction bands or thermal straps to the card support itself not to the machine frame. The screw 12 must be non- removable to ensure good thermal conduction to the frame.

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