Browse Prior Art Database

Integrated Circuit Test Adapter

IP.com Disclosure Number: IPCOM000044595D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Grace, AH: AUTHOR [+3]

Abstract

The device disclosed helps establish the flexibility needed to test new, as well as standard, integrated circuit package styles without extensive test hardware rebuild. The adapter 1 in Fig. 1 can be constructed out of a modified FR-4 epoxy laminate with at least one buried layer of circuitry 2. This material was selected based on its high temperature- and moisture-resistant characteristics, thus making it suitable for a wide range of stress applications. The circuitry 2 (or "trace") runs between a contact pad 3 at the point where the sample is to be inserted and a plated-through hole 4 in the dual/in-line pattern. As shown in Fig. 2, there is a recess 5 to minimize slippage of the device. There is also a cut-out 6 in the adapter beneath the device to prevent cold-spot condensation in temperature humidity environments.

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Integrated Circuit Test Adapter

The device disclosed helps establish the flexibility needed to test new, as well as standard, integrated circuit package styles without extensive test hardware rebuild. The adapter 1 in Fig. 1 can be constructed out of a modified FR-4 epoxy laminate with at least one buried layer of circuitry 2. This material was selected based on its high temperature- and moisture-resistant characteristics, thus making it suitable for a wide range of stress applications. The circuitry 2 (or "trace") runs between a contact pad 3 at the point where the sample is to be inserted and a plated-through hole 4 in the dual/in-line pattern. As shown in Fig. 2, there is a recess 5 to minimize slippage of the device. There is also a cut-out 6 in the adapter beneath the device to prevent cold-spot condensation in temperature humidity environments. One version of the adapter allows manual removal of the sample for inspection or to reuse the interposer. Fig. 3 and 4 show various spring-loaded means to retain the device 7 in the adapter 1. A second solderable version is possible if there is no wish to inspect the part or reuse the adapter. It is, in short, a "throwaway." The solderable adapter contact clips will be removed (as a process step), and the contact pads will be tinned. The device will be mounted, and the assembly will then undergo a vapor-phase soldering process.

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