Browse Prior Art Database

Electronic Substrate Cooling Device

IP.com Disclosure Number: IPCOM000044618D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Ellis, CW: AUTHOR

Abstract

An electronic substrate cooling system is reduced in overall size by utilizing the machinable/etchable ceramic heat exchanger and bonding the chip directly to the ceramic. This device is designed to allow the removal of internally generated heat from an electronic chip. An electronic chip, in whatever mechanical configuration that lends itself to easy thermal/mechanical attachment 11, is bonded to an evaporator 12, which is constructed by drilling a block of ceramic 13 and bonding endcaps 14 to the block. A refrigerating agent 15, i.e., water, FREON*, etc., is then passed through the resulting passageway, resulting in a direct heat exchange from the module to the refrigerating medium via the bonding agent and the ceramic block 12. * Trademark of E.I du Pont de Nemours & Co.

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Electronic Substrate Cooling Device

An electronic substrate cooling system is reduced in overall size by utilizing the machinable/etchable ceramic heat exchanger and bonding the chip directly to the ceramic. This device is designed to allow the removal of internally generated heat from an electronic chip. An electronic chip, in whatever mechanical configuration that lends itself to easy thermal/mechanical attachment 11, is bonded to an evaporator 12, which is constructed by drilling a block of ceramic 13 and bonding endcaps 14 to the block. A refrigerating agent 15, i.e., water, FREON*, etc., is then passed through the resulting passageway, resulting in a direct heat exchange from the module to the refrigerating medium via the bonding agent and the ceramic block 12. * Trademark of E.I du Pont de Nemours & Co.

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