Browse Prior Art Database

Polyimide Rip Stop Trench

IP.com Disclosure Number: IPCOM000044645D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Kirby, RC: AUTHOR

Abstract

A severe corrosion problem is presently experienced in bipolars. This corrosion is caused by moisture penetration into the polyimide edge seal or rip stop. A polyimide rip stop trench, formed within the outer perimeter of the chip, prevents this moisture penetration while also enhancing adhesion characteristics. The structure 11 is etched down into the silicon, and the dimensions are changed according to the varying processes. As shown in Fig. 1, the first layer of polyimide fills a single trench; alternatively, as shown in Fig. 2, both layers of polyimide fill separate trenches. In either case, the trenches 11 are not limited to a rectangular structure, but can be adapted to any geometry which lends itself to mechanical as well as chemical adhesion characteristics.

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Polyimide Rip Stop Trench

A severe corrosion problem is presently experienced in bipolars. This corrosion is caused by moisture penetration into the polyimide edge seal or rip stop. A polyimide rip stop trench, formed within the outer perimeter of the chip, prevents this moisture penetration while also enhancing adhesion characteristics. The structure 11 is etched down into the silicon, and the dimensions are changed according to the varying processes. As shown in Fig. 1, the first layer of polyimide fills a single trench; alternatively, as shown in Fig. 2, both layers of polyimide fill separate trenches. In either case, the trenches 11 are not limited to a rectangular structure, but can be adapted to any geometry which lends itself to mechanical as well as chemical adhesion characteristics.

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