Browse Prior Art Database

Monitor System for Electromigration Extrusion Detection

IP.com Disclosure Number: IPCOM000044730D
Original Publication Date: 1984-May-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Blusnavage, VA: AUTHOR [+4]

Abstract

This monitor system detects the presence and time of initiation of electromigration induced extrusions during long term high current stress testing of metal stripes on integrated circuit (IC) chips. Previously only open circuit fails were recorded. In order to detect extrusion fails (which can cause short circuits in IC's), a dead end sample monitor stripe is located adjacent to the sample stress stripe at minimum ground rule spacing. The monitor stripe is wired up as shown in the Figure.

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Monitor System for Electromigration Extrusion Detection

This monitor system detects the presence and time of initiation of electromigration induced extrusions during long term high current stress testing of metal stripes on integrated circuit (IC) chips. Previously only open circuit fails were recorded. In order to detect extrusion fails (which can cause short circuits in IC's), a dead end sample monitor stripe is located adjacent to the sample stress stripe at minimum ground rule spacing. The monitor stripe is wired up as shown in the Figure.

If the stripe fails by open circuit, the voltage drop across the sample is the 6V diode voltage and the voltage drop across the 10K monitor resistor (Rm) is 0.

If there is an extrusion bridging the gap between the stripes, current will flow through Rm and a voltage drop will be recorded proportional to the voltage drop across the sample where the extrusion occurred (plus the WV across the 1L resistor).

Disclosed anonymously

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