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Edge Connected Capacitors for Enhanced Multilayer Ceramic Packages

IP.com Disclosure Number: IPCOM000044780D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kraus, CJ: AUTHOR [+4]

Abstract

Decoupling capacitors are used to improve performance in high speed modules. In certain packages, they are C4-joined along with the logic chips to the substrate. The technique of connecting such capacitors edge wise (as contrasted to area wise) saves the substrate real estate, which is at a premium, from being used up by logic chips and EC pads, etc.

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Edge Connected Capacitors for Enhanced Multilayer Ceramic Packages

Decoupling capacitors are used to improve performance in high speed modules. In certain packages, they are C4-joined along with the logic chips to the substrate. The technique of connecting such capacitors edge wise (as contrasted to area wise) saves the substrate real estate, which is at a premium, from being used up by logic chips and EC pads, etc.

The multiple I/O's that an area interconnection provides are not always needed for decoupling capacitors since the connections needed are few, e.g., connections to different power planes. Hence, a capacitor having a row of C4's joined to a row of pads on the substrate, as shown in the figure, can be edge- joined to a row of pads on the substrate. The capacitance density can be further increased by connecting a stack of capacitors edge wise to common bus bars (lines) on the substrate.

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