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Piston Heatsink Design for Chip in Place Test Cooling

IP.com Disclosure Number: IPCOM000044809D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Markovics, JA: AUTHOR

Abstract

This heat sink is for cooling chips during chip in place test of the high powered modules. Spring loaded pistons 10, mounted in a water cooled holder 12 displayed in a symetrical matrix equal to the pitch matrix of the product but twice its size, are used to contact and cool all of the chips 14 in a module except for the chip 16 under test. The chip under test 16 is cooled via a single water cooled piston 18 of the same cross-sectional area and shape as the chip. This water cooled piston is also spring loaded and is mounted in the center of the probe 20 containing cantilever probe pins 22 that contact the test pads 24 arranged about the perimeter of the chip 16 for three 3 rows (180 points). Testing is performed in a helium filled chamber 26.

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Piston Heatsink Design for Chip in Place Test Cooling

This heat sink is for cooling chips during chip in place test of the high powered modules. Spring loaded pistons 10, mounted in a water cooled holder 12 displayed in a symetrical matrix equal to the pitch matrix of the product but twice its size, are used to contact and cool all of the chips 14 in a module except for the chip 16 under test. The chip under test 16 is cooled via a single water cooled piston 18 of the same cross-sectional area and shape as the chip. This water cooled piston is also spring loaded and is mounted in the center of the probe 20 containing cantilever probe pins 22 that contact the test pads 24 arranged about the perimeter of the chip 16 for three 3 rows (180 points). Testing is performed in a helium filled chamber 26.

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