Browse Prior Art Database

Reduced SER Package

IP.com Disclosure Number: IPCOM000044820D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Voldman, S: AUTHOR

Abstract

The soft error rate (SER) in an active semiconductor chip is significantly reduced by interposing a layer or island of molybdenum or other similar material between a single or multilayered ceramic substrate and the semiconductor chip.

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Reduced SER Package

The soft error rate (SER) in an active semiconductor chip is significantly reduced by interposing a layer or island of molybdenum or other similar material between a single or multilayered ceramic substrate and the semiconductor chip.

As shown in the figure, each chip has a molybdenum island located within the solder balls attaching the chip to the substrate. Molybdenum is used because it is the same metallurgy as that used in the multilayer ceramic substrate, as well as having a high alpha particle stopping power. The molybdenum islands should be made thick enough so that the residual energy of the transmitted alpha particles cannot induce soft error failures in the chip. The molybdenum island may be conveniently attached to the substrate by any known means and grounded.

Disclosed anonymously

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