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Package for Semiconductor Chips and Photodiode to be Connected to Optical Fiber

IP.com Disclosure Number: IPCOM000044832D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Boerstler, DW: AUTHOR [+2]

Abstract

A circuit package for optical and electrical components has alternating layers of metal and ceramic. A full layer forms the package base which carries internal wiring and supports conventional plug in connectors. Subsequent layers of metal and ceramic have openings that form a first cavity for optical components and a second cavity for semiconductor chips. A hole is provided in one end of the metal-ceramic structure for admitting an optical fiber to the first cavity for coupling to a photodiode. A metal cover seals the package. These components provide good electromagnetic shielding for both cavities.

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Package for Semiconductor Chips and Photodiode to be Connected to Optical Fiber

A circuit package for optical and electrical components has alternating layers of metal and ceramic. A full layer forms the package base which carries internal wiring and supports conventional plug in connectors. Subsequent layers of metal and ceramic have openings that form a first cavity for optical components and a second cavity for semiconductor chips. A hole is provided in one end of the metal-ceramic structure for admitting an optical fiber to the first cavity for coupling to a photodiode. A metal cover seals the package. These components provide good electromagnetic shielding for both cavities. The hole for the optical fiber makes it difficult to maintain a hermetic seal for the first cavity, but the separation between the two cavities provides normal hermetic sealing for the semiconductor chips in the second cavity.

Disclosed anonymously

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