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Soldering Method using Changes in Soldering Iron Temperature to Signal Steps in Process

IP.com Disclosure Number: IPCOM000044884D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Goldfarb, SM: AUTHOR

Abstract

Soldering is performed with a standard solder iron which contains a temperature sensor. Thermal data is used to signal that the iron has reached proper operating temperature to begin soldering. It is also used to detect a drop in temperature and rate of change of the temperature drop when the heated iron touches a component to be soldered. Massive joints requiring long heat-up times cause gradual asymptotic temperature drops, and are sufficiently hot when the temperature levels off. Less massive joints which cause a rapid temperature drop followed by a rapid increase are properly heated when the temperature begins increasing. These methods eliminate the need to determine specific heat-up times for individual solder joints. The soldering process is controlled by monitoring both asymptotic and rapid temperature drops.

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Soldering Method using Changes in Soldering Iron Temperature to Signal Steps in Process

Soldering is performed with a standard solder iron which contains a temperature sensor. Thermal data is used to signal that the iron has reached proper operating temperature to begin soldering. It is also used to detect a drop in temperature and rate of change of the temperature drop when the heated iron touches a component to be soldered. Massive joints requiring long heat-up times cause gradual asymptotic temperature drops, and are sufficiently hot when the temperature levels off. Less massive joints which cause a rapid temperature drop followed by a rapid increase are properly heated when the temperature begins increasing. These methods eliminate the need to determine specific heat- up times for individual solder joints. The soldering process is controlled by monitoring both asymptotic and rapid temperature drops. Solder is then fed to the joint, which causes an additional second temperature drop. This drop is readily detectable because the iron supplies the heat of fusion for the solder. A normal soldering operation has a predictable time-temperature signature, so that abnormal operation can be detected.

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