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Cold Plate with Resilient Metallic Interface for Heat Transfer from Circuit Module

IP.com Disclosure Number: IPCOM000044910D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Moran, KP: AUTHOR [+3]

Abstract

A cold plate makes contact with a circuit module through a flattened coil of wire. The coil is oriented so that almost half of each turn contacts the cold plate and almost half contacts the module. The portion of the coil that contacts the cold plate is soldered or otherwise connected mechanically and thermally to the cold plate. The coil is resilient, and the coil portions that face the module are held against the module by spring pressure. The cold plate and the module can be separated for repair. The resilient coil adjusts for small variations in the height of the module. A coil spring assembly can be spaced from the cold plate to contact a module of lower height.

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Cold Plate with Resilient Metallic Interface for Heat Transfer from Circuit Module

A cold plate makes contact with a circuit module through a flattened coil of wire. The coil is oriented so that almost half of each turn contacts the cold plate and almost half contacts the module. The portion of the coil that contacts the cold plate is soldered or otherwise connected mechanically and thermally to the cold plate. The coil is resilient, and the coil portions that face the module are held against the module by spring pressure. The cold plate and the module can be separated for repair. The resilient coil adjusts for small variations in the height of the module. A coil spring assembly can be spaced from the cold plate to contact a module of lower height.

The drawing shows a module 2, a circuit board 3 that holds the module, and a cold plate 4 that removes heat from the module. The structure that positions the cold plate with respect to the module and circuit board is not shown. A coil 5 has its upper surface 6 securely attached to the cold plate and its lower surface 7 held resiliently against the top of the module.

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