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Heat Pipe Vapor Cooling Etched Silicon Structure

IP.com Disclosure Number: IPCOM000044925D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Eldridge, JM: AUTHOR [+2]

Abstract

This structure for cooling an integrated circuit semiconductor chip comprises a heat pipe, a silicon circuit chip, and a (110) silicon wafer arranged to be bonded to the reverse side of the circuit chip, and having anisotropically etched grooves on the reverse side remote from the circuit chip over which the heat pipe structure is arranged. Wicking material lining the heat pipe and contacting the grooves is saturated with a low boiling-point, high surface-tension liquid for vapor cooling the silicon wafer and the attached circuit chip.

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Heat Pipe Vapor Cooling Etched Silicon Structure

This structure for cooling an integrated circuit semiconductor chip comprises a heat pipe, a silicon circuit chip, and a (110) silicon wafer arranged to be bonded to the reverse side of the circuit chip, and having anisotropically etched grooves on the reverse side remote from the circuit chip over which the heat pipe structure is arranged. Wicking material lining the heat pipe and contacting the grooves is saturated with a low boiling-point, high surface-tension liquid for vapor cooling the silicon wafer and the attached circuit chip.

One example of structure according to the concept is illustrated. A multilayer conductor (MLC) 12 is connected to an electronic integrated circuit chip 14 in known fashion using solder ball or like bonds, with the circuit components mounted towards the MLC. The reverse of the circuit chip 14 is bonded to a cooling wafer 16. This cooling wafer is made of (110) silicon, and etched anisotropically to form a multiple of grooves 18 across a circular pattern defined by a bellows spring 20. Alternately, an annular groove is also etched for accommodating the base of the bellows spring 20. A heat pipe 22 is affixed to the upper end of the bellows spring 20, and the space is closed at the upper end of the pipe. Wicking material 24 lines the heat pipe and the bellows spring, and contacts the lands and grooves 18. A suitable heat sink, for example a finned structure 26 as illustrated, serves to remove heat from the overall structure.

This wicking material 24 and the etched grooves 18 are saturated with a low boiling-point, high surface-tension liquid, such as water, some alcohols, or other organic solvents. The overall assembly forms a...