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Flux for 100 Degrees C to 200 Degrees C Range

IP.com Disclosure Number: IPCOM000044951D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Grebe, KR: AUTHOR [+4]

Abstract

An improved solder flux which can be used with solders having melting points in the range 100-200 degrees C is described. This solder flux comprises 10% 1-hydroxy benzene sulfonic acid and 90% polyethylene glycol 400. This flux dissolves the solder and/or metal oxides, protects the solder during heating and cooling, allows the molten solder balls, pads, etc., to coalesce, and is water-soluble.

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Flux for 100 Degrees C to 200 Degrees C Range

An improved solder flux which can be used with solders having melting points in the range 100-200 degrees C is described. This solder flux comprises 10% 1-hydroxy benzene sulfonic acid and 90% polyethylene glycol 400. This flux dissolves the solder and/or metal oxides, protects the solder during heating and cooling, allows the molten solder balls, pads, etc., to coalesce, and is water- soluble.

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