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Coined Precision Mount for Fiber Optic Driver Receiver Surface Diodes

IP.com Disclosure Number: IPCOM000044995D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Balliet, L: AUTHOR [+3]

Abstract

At present, alignment of fiber optic components is done via manually operated micro-positioners or by the use of precision machined parts. Both methods are expensive. Furthermore, surface emitting LEDs and most photodiodes are not conveniently compatible with planar type packaging. Planar packaging is extensively used in the industry. This arrangement provides a low cost, precision mounting for surface emitting LEDs and surface sensitive photodiodes. It permits a low profile (low height) module with the fiber entering or exiting from the end, and consequently is compatible with planar packaging.

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Coined Precision Mount for Fiber Optic Driver Receiver Surface Diodes

At present, alignment of fiber optic components is done via manually operated micro-positioners or by the use of precision machined parts. Both methods are expensive. Furthermore, surface emitting LEDs and most photodiodes are not conveniently compatible with planar type packaging. Planar packaging is extensively used in the industry. This arrangement provides a low cost, precision mounting for surface emitting LEDs and surface sensitive photodiodes. It permits a low profile (low height) module with the fiber entering or exiting from the end, and consequently is compatible with planar packaging.

The figure shows the arrangement as it applies to either a driver or a receiver module. The mounting block 1 is made of moderately soft conductive metal, such as copper. The top surface of the block contains grooves and cavities that are precisely formed relative to each other and with the surface by use of the coining fabrication process. A groove 2 guides and positions the fiber relative to a surface sensitive device 3 which is located in cavity 4. Surface devices can be manufactured to size tolerances (under present art) to less than +/- .001 inch. This, in conjunction with the precision of the block, will result in losses due to misalignment within acceptable levels.

Advantages are as follows:

1. Precision fiber to device alignment.

2. Compatible with low profile, planar packaging.

3. Excellent ther...