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Browse Prior Art Database

Peel A Part Copper Wet Peel Apparatus

IP.com Disclosure Number: IPCOM000045043D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

McBride, DG: AUTHOR [+2]

Abstract

Separating the layers in peel-a-part copper which is used to fabricate printed circuit boards can be facilitated by applying a fluid at the point where the two layers are being separated.

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Peel A Part Copper Wet Peel Apparatus

Separating the layers in peel-a-part copper which is used to fabricate printed circuit boards can be facilitated by applying a fluid at the point where the two layers are being separated.

The device shown above facilitates the application of liquid as the layers of peel-a-part copper are being separated. The mechanism includes a stand or holder 10 with a slot 11 where a circuit board 12 can be positioned. The top layer of the peel-a-part copper is attached to drum 15 which is rotated by motor
16. Fluid dispenser 20 applies an appropriate fluid where the peel-a-part carrier layer 30 is separated from the bottom layer 31 of the peel-a-part copper.

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