Browse Prior Art Database

Chip Cooling Structure

IP.com Disclosure Number: IPCOM000045089D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Mansuria, MS: AUTHOR [+3]

Abstract

A right-angled, hinged, heat transfer member with a spring disposed at 45 degrees with respect to the right angle provides intimate resilient contact with both the chip and the heat sink.

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Chip Cooling Structure

A right-angled, hinged, heat transfer member with a spring disposed at 45 degrees with respect to the right angle provides intimate resilient contact with both the chip and the heat sink.

In the drawing, the right-angled, hinged, heat transfer member 10 is resiliently urged by the spring and ball assembly 11 into intimate heat transfer contact with the hat (heat sink) 12 and the chip 13. With the 45 degrees orientation of the spring, the component forces produce both a horizontal and a vertical component to maintain the contact between the member 10 and the heat sink 12 and chip
13.

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