Browse Prior Art Database

Thermally Controlled Metal Socket for Removing or Replacing Semiconductor Device

IP.com Disclosure Number: IPCOM000045105D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Bansal, JP: AUTHOR

Abstract

A thermally controlled metal socket is disclosed for enabling the nondestructive removal of a semiconductor device 2 bonded with solder to a module substrate 4. A high thermal conductivity metal plate 6 has a plurality of holes 8 drilled in its surface, drilled in a pattern which matches the pattern of pins 10 projecting from the underside of the module substrate 4 upon which is mounted the integrated circuit chip 2 to be removed. The metal plate 6 is heated by the hot plate 12 to the approximate melting temperature of the solder which bonds the integrated circuit chip 2 to the module substrate 4.

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Thermally Controlled Metal Socket for Removing or Replacing Semiconductor Device

A thermally controlled metal socket is disclosed for enabling the nondestructive removal of a semiconductor device 2 bonded with solder to a module substrate 4. A high thermal conductivity metal plate 6 has a plurality of holes 8 drilled in its surface, drilled in a pattern which matches the pattern of pins 10 projecting from the underside of the module substrate 4 upon which is mounted the integrated circuit chip 2 to be removed. The metal plate 6 is heated by the hot plate 12 to the approximate melting temperature of the solder which bonds the integrated circuit chip 2 to the module substrate 4. A vacuum pencil 14 is located immediately above the integrated circuit chip 2 so that when the solder bonds between the chip and the substrate 4 have melted, the chip 2 will be immediately drawn away from the substrate 4 by the vacuum pencil 14.

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