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Browse Prior Art Database

Vapor Phase Contact Reflow Soldering

IP.com Disclosure Number: IPCOM000045129D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Kelley, FJ: AUTHOR

Abstract

This apparatus for closed loop cycle operation in vapor generation, application and recovery is desirable for soldering contact structures on edge card connectors. Fluid is drawn from a supply tank into a boiling chamber, and the resulting vapor is then drawn into a working chamber having a slot in one side sealed by flexible lips of suitable material. The card to be worked is partially inserted by way of the lips, and soldering takes place. Most of the vapor is liquified in the soldering process. This liquid is pumped out, scrubbed and returned to the supply tank.

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Vapor Phase Contact Reflow Soldering

This apparatus for closed loop cycle operation in vapor generation, application and recovery is desirable for soldering contact structures on edge card connectors. Fluid is drawn from a supply tank into a boiling chamber, and the resulting vapor is then drawn into a working chamber having a slot in one side sealed by flexible lips of suitable material. The card to be worked is partially inserted by way of the lips, and soldering takes place. Most of the vapor is liquified in the soldering process. This liquid is pumped out, scrubbed and returned to the supply tank.

A supply tank 10 contains FLUORINENT Trademark of 3M Company liquid. A liquid line 12 communicates with a boiling chamber 14 where the liquid is vaporized. Some of the vapor is valved off to a working chamber 16 connected to a pump 18, creating a partial vacuum in the chamber 16 and drawing in the vapor. A workpiece 20, shown here as a circuit card, is partially inserted into the chamber 16 through a port 22 which allows ready insertion of the workpiece, but forms a gas-tight seal. Because the chamber 16 is being evacuated while the workpiece is inserted and with drawn, vapor does not escape.

Once the soldering process is completed, the cooled vapor and liquid is moved, by the return stroke of the pump 18, to a water scrubber 24. The scrubbed liquid is returned to the supply tank 10, which normally has a vapor blanket atop the liquid.

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