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Polishing Electroless Nickel

IP.com Disclosure Number: IPCOM000045203D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mendel, E: AUTHOR

Abstract

This method for generating a highly specular, defect free finish on electroless nickel layers entails the use of colloidal dispersions of silicon dioxide in water in conjunction with either poromeric polishing pads or polyurethane impregnated polyester polishing felts.

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Polishing Electroless Nickel

This method for generating a highly specular, defect free finish on electroless nickel layers entails the use of colloidal dispersions of silicon dioxide in water in conjunction with either poromeric polishing pads or polyurethane impregnated polyester polishing felts.

The polishing slurry consists of 20 90 millimicron sized silicon dioxide particles dispersed in water in the range of 6 thru 15 weight per cent SiO(2). The pH of the slurry can be used over a wide range from approximately pH 5 to pH
12. Adjustments to the pH are made using HC1 to lower the pH, or NaOH or KOH to increase the pH. Polishing pressures are low, on the order of 1 - 4 psi. Polishing times to achieve a feature less surface are on the order of 1 hour; however, times can very depending on the condition of the starting material.

Poromeric polishing pads, or polyurethane impregnated polyester felts, used under the range of conditions described above, result in a surface finish of 0.2 micro inch CLA.

The polishing mechanism is not clearly understood at this time, but it is believed to be a chem-mech process, and not abrasive in nature. While this method works particularly well in removing material in a controllable way from thin deposits or layers of nickel, it can also be used to polish massive or solid nickel workpieces.

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