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Reduction of Grinding and Lapping Defects

IP.com Disclosure Number: IPCOM000045206D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mendel, E: AUTHOR [+2]

Abstract

This article describes a concept to round-off or chamfer the edges of a friable workpiece, such as a silicon wafer, before surface grinding or lapping. The edge rounding will reduce or eliminate losses due to cracks and scratches at the edge or in the body of the workpiece. These cracks and scratches, usually called defects, are caused by very small chips of the workpiece breaking away from the workpiece edge. The tendency to produce edge chips is particularly acute when the workpieces have sharp edges, as will occur after slicing.

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Reduction of Grinding and Lapping Defects

This article describes a concept to round-off or chamfer the edges of a friable workpiece, such as a silicon wafer, before surface grinding or lapping. The edge rounding will reduce or eliminate losses due to cracks and scratches at the edge or in the body of the workpiece. These cracks and scratches, usually called defects, are caused by very small chips of the workpiece breaking away from the workpiece edge. The tendency to produce edge chips is particularly acute when the workpieces have sharp edges, as will occur after slicing.

We teach the use of edge rounding (chamfering) before the grinding or lapping operations. Rounded edges are significantly less friable and result in improved grinding and lapping yields. The typical process flow will indicate (1) slicing, (2) edge rounding (chamfering), (3) surface grinding or lapping, (4) edge rounding (chamfering), (5) etching to remove mechanical damage, and (6) polishing.

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