Browse Prior Art Database

High Throughput Dice and Pick Tool

IP.com Disclosure Number: IPCOM000045221D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 77K

Publishing Venue

IBM

Related People

Shils, AJ: AUTHOR

Abstract

Chip P/N, etc., identity is maintained by the use of this integrated dice/pick tool. Neither double-sided tape nor pointed chip pushing prongs are used.

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High Throughput Dice and Pick Tool

Chip P/N, etc., identity is maintained by the use of this integrated dice/pick tool. Neither double-sided tape nor pointed chip pushing prongs are used.

An overview of this tool is depicted in Fig. 1. Main tool features are dual vacuum chuck 1, the pick vacuum head 2, chip drop plate(s) 3, the control microprocessor 4, and the saw(s) 5. Basic Operation.

A wafer is oriented on the chuck 1, as depicted in Fig. 2. Each chip location has vacuum applied by one or more vacuum ports under each chip. Between each chip in the kerf areas is a separate groove. All such kerf grooves are connected to a common vacuum manifold (which is separate from the manifold used to hold the chips) which removes the "sawdust" and wash solution. The chip vacuum manifold will hold the individual chips in place as they are cut apart. An overall vacuum can be placed above the wafer to catch "sawdust" thrown up by the saw(s) or vaporized material if a laser cutter is used.

The saw cuts the wafer into chips. When all scrap and wash is removed, the kerf vacuum is released. The chip vacuum holds the chips in place.

The pick vacuum head 2, as depicted in Fig. 3, is lowered onto the chip array, and individual vacuum pencils rest gently on each chip. Soft ends prevent solder pad (contact) damage and allow vacuum sealing. All pick vacuum head pencils are turned on, and with every chip attached to its pencil the chuck chip vacuum is turned off. The pick vacuum head is...