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Test Site to Increase Effective Cross Over Area for Insulation Integrity Testing

IP.com Disclosure Number: IPCOM000045226D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Calabrese, GM: AUTHOR [+2]

Abstract

The effective area of orthogonal conductive grids for testing the integrity of intervening insulation is increased by the deposition of a thin aluminum layer on one of the grids.

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Test Site to Increase Effective Cross Over Area for Insulation Integrity Testing

The effective area of orthogonal conductive grids for testing the integrity of intervening insulation is increased by the deposition of a thin aluminum layer on one of the grids.

A problem encountered in multilevel chip design is that of measuring the insulation integrity. To do this, the metal grids are superimposed, one on top of another on a chip test site. A continuity check is used to determine the insulator integrity. The effective grid area is the cross-over area. A plate cannot be used to increase effective cross-over area, since the topology of the metal is critical in determining insulator integrity.

In order to improve effective cross-over area while maintaining the topology, a thin film of metal (A1) approx. 1O00 Angstroms thick is deposited onto the normal grid, as shown. This permits interlevel shorts to be found anywhere over the entire area of the grid, not just at the cross-over area. Since the metal film area is so large, complete coverage (e.g., at steps) is not necessary in order to get good results.

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