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Method for Improving Adhesion Between Solder Mask and Substrate

IP.com Disclosure Number: IPCOM000045270D
Original Publication Date: 1983-Feb-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Morisawa, H: AUTHOR [+2]

Abstract

Prior to application of a photosensitive solder mask onto a circuitized metallic (copper) and dielectric surface or an uncircuitized metallic surface, the surface is pretreated by scrubbing it with a brush and grits, immersing the surface into an aqueous solution containing Sodium chlorite (NaC1O(2)) 25 g/1 Sodium tertiary phosphate (Na(3)PO(4)) 10 g/1 Sodium hydroxide (NaOH) 13 g/1 at about 80-90 degrees C for about 2-5 minutes, and then removing an oxide film thereon by using HC1.

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Method for Improving Adhesion Between Solder Mask and Substrate

Prior to application of a photosensitive solder mask onto a circuitized metallic (copper) and dielectric surface or an uncircuitized metallic surface, the surface is pretreated by scrubbing it with a brush and grits, immersing the surface into an aqueous solution containing
Sodium chlorite (NaC1O(2)) 25 g/1
Sodium tertiary phosphate (Na(3)PO(4)) 10 g/1 Sodium hydroxide (NaOH) 13 g/1 at about 80-90 degrees C for about 2-5 minutes, and then removing an oxide film thereon by using HC1.

This process provides a coarse surface for substantially improving adhesion between the photosensitive solder mask and the substrate surface.

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