Browse Prior Art Database

Electroless Plating Rate Monitor

IP.com Disclosure Number: IPCOM000045335D
Original Publication Date: 1983-Mar-01
Included in the Prior Art Database: 2005-Feb-06
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Kovac, Z: AUTHOR [+2]

Abstract

This monitor allows nearly continuous measurement of electroless metal deposition in an aqueous environment. The monitor includes a substrate 10 on which a solid copper section 12 is deposited, along with several copper lines 14, 16, 18, 20, 22, 24, and 26. Contact pads are located at the ends of the lines 14-26, so that electrical connections can be made to a recorder 28 and a AC scanner 30. Substrate 10 is a smooth inert material, such as glass, silicon, ceramic, epoxy, polypropylene, etc. The substrate material is chosen as one which is not attacked by the electroless plating bath and, for copper plating, glass or silicon will not be used. The spacing between each of the lines 14-26 is variable, as is the spacing between the ends of the lines 14-26 and the solid copper section 12.

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Electroless Plating Rate Monitor

This monitor allows nearly continuous measurement of electroless metal deposition in an aqueous environment. The monitor includes a substrate 10 on which a solid copper section 12 is deposited, along with several copper lines 14, 16, 18, 20, 22, 24, and 26. Contact pads are located at the ends of the lines 14- 26, so that electrical connections can be made to a recorder 28 and a AC scanner 30. Substrate 10 is a smooth inert material, such as glass, silicon, ceramic, epoxy, polypropylene, etc. The substrate material is chosen as one which is not attacked by the electroless plating bath and, for copper plating, glass or silicon will not be used. The spacing between each of the lines 14-26 is variable, as is the spacing between the ends of the lines 14-26 and the solid copper section 12. The variable spacings increase from about 1 micron to about 100 microns.

In operation, electrical connection is made to the contact pads on the monitor and the unactivated monitor is placed into the electroless copper plating bath. Because the circuitry is copper, electroless deposition begins immediately. The AC scanner and chart recorder is turned on, and scans all lines with time. Due to the plating, the lines 14-26 will begin to contact one another with time and will also contact the copper section 12. Since all lines plate the same amount from time zero, increasing space widths have been used to provide an indication of the amount of plating tha...