Browse Prior Art Database

Automated Dry Etching or Deposition System

IP.com Disclosure Number: IPCOM000045481D
Original Publication Date: 1983-Mar-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Stein, H: AUTHOR

Abstract

This system consists of a vacuum chamber with a rotary angular disk, dry etching or deposition means, a device for measuring the etch or deposition rate, two evacuatable locks attached to the vacuum chamber and each comprising a handler for transporting substrate holders to and from the angular disk, as well as controls for directing the handlers.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 53% of the total text.

Page 1 of 2

Automated Dry Etching or Deposition System

This system consists of a vacuum chamber with a rotary angular disk, dry etching or deposition means, a device for measuring the etch or deposition rate, two evacuatable locks attached to the vacuum chamber and each comprising a handler for transporting substrate holders to and from the angular disk, as well as controls for directing the handlers.

The figure is a top view of the vacuum chamber, the angular disk and the locks. The dry etching or deposition means in vacuum chamber 1 consist, for example, of the two planar electrodes of a planar plasma reactor, with the lower electrode being the rotary angular disk 8. Disk 8 is provided with positions for substrate holders 9. These positions are located along concentric circles surrounding the rotary axis. The supply of reactive gases and their disposal after they have been exhausted are effected through at least one gas inlet and one gas outlet in the wall of vacuum chamber 1. Device 10 for measuring the thickness of the removed or deposited material has a fixed measuring position 11 above each of the circles along which substrate holders 9 are located. Such a device 10 is described in the preceding article.

Locks 2 and 5 are separated from vacuum chamber 1 by valves 3 and 6 and from their environment by valves 4 and 7, respectively. Via locks 2 and 5, substrate holders 9 are transported into and removed from vacuum chamber 1 without aerating it. The handlers are instructed by controls receiving their input from device 10.

During operation, for example, when substrates are to be etched, disk 8 rotates in steps...