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Silicon Leadless Insertion Device for Laser Diode Alignment and Contacting

IP.com Disclosure Number: IPCOM000045538D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 3 page(s) / 53K

Publishing Venue

IBM

Related People

Brady, MJ: AUTHOR [+2]

Abstract

A packaging method is described for an injection laser wherein the laser die is entrapped (sandwiched) between two opposing preformed (crystallographically etched silicon) elements which simultaneously contact and are soldered to both sides of the die and to each other In one embodiment the laser die is also automatically and simultaneously aligned with one of the preformed elements for automatic alignment of the laser chip with other optical elements.

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Silicon Leadless Insertion Device for Laser Diode Alignment and Contacting

A packaging method is described for an injection laser wherein the laser die is entrapped (sandwiched) between two opposing preformed (crystallographically etched silicon) elements which simultaneously contact and are soldered to both sides of the die and to each other In one embodiment the laser die is also automatically and simultaneously aligned with one of the preformed elements for automatic alignment of the laser chip with other optical elements.

Silicon Optical Bench (SOB) packaging of A1GaAs lasers (1) for optical communications and for laser liquid crystal displays (LLCDs) requires good alignment of the laser die to the SOB. A flying lead is normally required for the N-side contact. This assembly, at present, is a hand labor-intensive job. The Silicon Leadless Insertion Device (SLID) described here provides a means for overcoming some of these packaging problems, and provides a degree of ruggedness and ease of handling the laser die. The SLID is intended to provide:
(1) elimination of the flying N-side contact lead, (2) simplified alignment of a structured device, and (3) additional heat sinking capabilities. This additional heat sinking may permit continuous wave (CW) testing of the die before final bonding.

The SLID is a silicon chip which has been configured by preferential etching to provide a recessed region, and metallized to provide a solderable conducting surface. It is intended for use with the Silicon Optical Bench (SOB) and channel bonding (2). The etched structure is designed to provide a well into which the N- side of a laser die can be placed and soldered (Fig. 1). The depth and width of the well are chosen so that a laser die bonded to the SLID can have its P-contact surface in the same plane as the "top" surface of the SLID. It should be noted that it is not desirable to force the P-side of the laser into a co-planar relationship with the SLID top at the time the laser is attached to the SLID. This co-planarity can be achieved easily at the time that the P-...