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Interface Metallurgy for Mercury Contacts

IP.com Disclosure Number: IPCOM000045545D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 20K

Publishing Venue

IBM

Related People

Tu, KN: AUTHOR [+2]

Abstract

Mercury contacts for microelectronic connections can yield poor contacts due to the fact that mercury dewets the metal base on which it is located or amalgamates with the metal base within a short time. This reduces the cycle time of the contact, and is especially troublesome in a technology, such as Josephson technology, where extreme temperature cycling occurs. In order to have a satisfactory mercury contact, the contact surface must have free or liquid mercury at all times, and the mercury must adhere well to its base. In order to achieve controlled adhesion of the metal base or circuit wiring by the use of mercury, an interface structure is used between the circuit wiring and base. This interface structure is comprised of a plurality of layers between the liquid mercury and underlying base.

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Interface Metallurgy for Mercury Contacts

Mercury contacts for microelectronic connections can yield poor contacts due to the fact that mercury dewets the metal base on which it is located or amalgamates with the metal base within a short time. This reduces the cycle time of the contact, and is especially troublesome in a technology, such as Josephson technology, where extreme temperature cycling occurs. In order to have a satisfactory mercury contact, the contact surface must have free or liquid mercury at all times, and the mercury must adhere well to its base. In order to achieve controlled adhesion of the metal base or circuit wiring by the use of mercury, an interface structure is used between the circuit wiring and base. This interface structure is comprised of a plurality of layers between the liquid mercury and underlying base.

In an example of a Nb base, a suitable interface structure is comprised of layers of noble metals, and specifically layers of Ti/Pd, Hf/Pd, or Ir/Pd.

The figure shows an Nb base having a Pd layer thereover, a next layer of phased Ti/Pd, another Pd layer, a Au layer, and then the mercury top layer. The phased layer goes from 100% Pd to 100% Ti, one component increasing an amount while the other decreases at the same rate.

Hf/Pd and Ir/Pd can be used in place of the graded Ti/Pd layer in the drawing.

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