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Browse Prior Art Database

Soft Contact Loading of Wafer In Exposure Tool

IP.com Disclosure Number: IPCOM000045593D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Gagne, M: AUTHOR [+2]

Abstract

This article discloses an apparatus for aligning wafers in photomask exposure tools. In the figure there is shown a sectional view of a chuck assembly 10 containing a wafer-holding puck 11 which is supported in the chuck assembly 10 by a plurality of bellows 12. The wafer 13, which is to be placed in contact with an exposure ring 14 is maintained on the puck 11. In operation the wafer is mounted on the puck 11 and held there by suitable vacuum means or the like (not shown). The puck and wafer are then retracted into the interior of the chuck assembly by evacuating and collapsing the bellows 12. The chuck assembly 10 is then brought Into position on the frame around the ring 14 and locked thereon by suitable vacuum means.

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Soft Contact Loading of Wafer In Exposure Tool

This article discloses an apparatus for aligning wafers in photomask exposure tools. In the figure there is shown a sectional view of a chuck assembly 10 containing a wafer-holding puck 11 which is supported in the chuck assembly 10 by a plurality of bellows 12.

The wafer 13, which is to be placed in contact with an exposure ring 14 is maintained on the puck 11. In operation the wafer is mounted on the puck 11 and held there by suitable vacuum means or the like (not shown). The puck and wafer are then retracted into the interior of the chuck assembly by evacuating and collapsing the bellows 12. The chuck assembly 10 is then brought Into position on the frame around the ring 14 and locked thereon by suitable vacuum means. Once the chuck is locked on the frame, the bellows 12 are individually and simultaneously inflated to cause the puck 11 to move toward tabs 15 which are on the interior of the ring 14. The wafer is then brought into contact with the tabs 15 and maintained in the position for alignment and exposure. After exposure, the bellows 12 are deflated, causing the puck 11 and wafer 13 to retract into chuck assembly 10 prior to unloading.

This method prevents excessive resist, buildup and contamination on the tabs associated with spring-loaded chucks, thus eliminating focal-plane changes In the tool while maintaining simplicity and reliability of the tool.

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