Browse Prior Art Database

Subsurface Defect Removal Tool

IP.com Disclosure Number: IPCOM000045609D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Dikhofer, W: AUTHOR [+3]

Abstract

Subsurface defects in laminated circuit panels can be removed by a hand-operated end mill set to the required cutting depth.

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Subsurface Defect Removal Tool

Subsurface defects in laminated circuit panels can be removed by a hand- operated end mill set to the required cutting depth.

Referring to the figure, a dual layered holding fixture 1 has a central opening 2 through which crosshairs 3 and a smaller opening 4 can be seen. A bushing 5 sets on the lower transparent layer, and an end mill 6 having a handle 7 attached by means of a set screw 8 is inserted in the bushing so that the lower extreme of the end mill passes through the smaller opening of the lower layer. The end mill can be set to the proper depth by placing the bushing over a selected groove 9 of the desired depth in a setup block 10 and adjusting the handle relative to the end mill by means of the set screw. The gauging grooves of the setup block necessarily are deep enough to accommodate the thickness of the bottom layer of the holding fixture.

A defect is located through the crosshairs with the smaller hole aligned over the defect, and the bushing is placed in the larger opening. The end mill, with attached handle, is inserted in the bushing, and the handle is rotated to cut the laminate to the desired depth.

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