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Browse Prior Art Database

Solder Residue Removal and Site Dressing on Chip Site Using Capillary Action

IP.com Disclosure Number: IPCOM000045680D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Carr, B: AUTHOR [+2]

Abstract

This invention is a process for the removal of chip-site solder using a capillary tube. Present methods of chip-site dress have two disadvantages: (1) uneven solder removal and (2) solder debris retention under adjacent chips.

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Solder Residue Removal and Site Dressing on Chip Site Using Capillary Action

This invention is a process for the removal of chip-site solder using a capillary tube. Present methods of chip-site dress have two disadvantages: (1) uneven solder removal and (2) solder debris retention under adjacent chips.

With the proposed process, solder removal is achieved by heating a fluxed capillary tube and applying it to solder columns on chip sites. Prior to application, the substrate Is bias heated. By capillary action, the excess solder is drawn into the tube and discarded. The process can be improved by utilizing fretted, porous, glass flux-filled chips heated to the solder melting point. Local heat transfer on a chip site can be effected by infrared heating through the alumina in a porous chip. This prevents metal transfer to chip joints.

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