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Lead Copper Tin Co Evaporation Process System

IP.com Disclosure Number: IPCOM000045810D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Brown, WW: AUTHOR [+4]

Abstract

This article concerns apparatus and a method for depositing a lead, tin, copper alloy chip mount solder ball having reduced tendency for electromigration. The apparatus and method feature structure and steps for centrally locating a lead source in a vacuum chamber beneath the sample to be metallized. The lead source is flanked by a tin source on one side and a copper source on the other so that the combined sources may be co-evaporated.

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Lead Copper Tin Co Evaporation Process System

This article concerns apparatus and a method for depositing a lead, tin, copper alloy chip mount solder ball having reduced tendency for electromigration. The apparatus and method feature structure and steps for centrally locating a lead source in a vacuum chamber beneath the sample to be metallized. The lead source is flanked by a tin source on one side and a copper source on the other so that the combined sources may be co-evaporated.

In accordance with the apparatus and method of this article, the lead source is centrally located in a conventional evaporation system and arranged to be evaporated by a conventional RF induction heating unit. Additionally, the lead source is flanked by a tin source and a copper source whose positions are adjustable. The tin and copper sources are arranged to be evaporated by resistance heating using conventional resistance heating means. In accordance with the method, the metals are co-evaporated to achieve the desired metallurgical character for the alloy.

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