Browse Prior Art Database

Chip Locator Block with Vacuum Pencil Pick Up Point

IP.com Disclosure Number: IPCOM000045882D
Original Publication Date: 1983-Apr-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Frank, V: AUTHOR

Abstract

After flip-chip-type semiconductor chips have been diced from their wafers, they are placed in a gravity feed track and aligned for pick-up by means of a vacuum pencil for placement on a contacter for testing. A problem has arisen in reliably orienting the chip prior to its pick-up by the vacuum pencil, and this problem is illustrated in Fig. 1.

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Chip Locator Block with Vacuum Pencil Pick Up Point

After flip-chip-type semiconductor chips have been diced from their wafers, they are placed in a gravity feed track and aligned for pick-up by means of a vacuum pencil for placement on a contacter for testing. A problem has arisen in reliably orienting the chip prior to its pick-up by the vacuum pencil, and this problem is illustrated in Fig. 1.

Fig. 1 shows the chip 4 which has been stopped by the stop 2. Chip 4 has been inadvertently lifted by the edge of chip 5, in a malfunction called "shingling" wherein the chip 4 rises and overlaps chip 5. When the vacuum pencil 3 is lowered to pick up chip 4, it is ordinarily lowered to a position of approximately three-thousandths of an inch above the desired horizontal position for the chip. If the chip 4 has undergone the shingling defect, it will be crushed by the tip of the vacuum pencil 3. The force of the chip 5 against the chip 4, causing the shingling malfunction, is due to the gravity feed of the sequence of chips following chip 5 in the track of the chip-locator block 1. The shingling malfunction has been avoided for those chips 5 which succeed the chip 4, by the provision of the partial covers 6 shown in Figs. 1 and 2. The covers 6 are designed to mount at approximately from one to three-thousandths of an inch above the upper surface of the chip 5 so that the shingling malfunction will not occur. However, at the point beneath the vacuum pencil 3 where the chip 4 must be lifted, the covers 6 cannot be used and t...