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Manufacturing Products Requiring Lithographic Patterns

IP.com Disclosure Number: IPCOM000045898D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gutierrez, A: AUTHOR [+2]

Abstract

The following method is capable of producing, in large quantities, parts which must be manufactured using lithographic techniques, e.g., printed circuits.

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Manufacturing Products Requiring Lithographic Patterns

The following method is capable of producing, in large quantities, parts which must be manufactured using lithographic techniques, e.g., printed circuits.

The method involves the use of a low vapor pressure liquid that may be coated onto a substrate and subsequently hardened into a film using a low dose from an electron beam that operates in air. The lithographic pattern is then completely dry etched into the hardened film using another electron beam exposure but which operates at a higher dose. This latter exposure may either be performed with a scanning electron beam (to create the desired lithographic pattern) or with a stationary electron beam curtain coupled with a mask. The whole process can operate very rapidly (3l0-l00 ft/min) because, after the liquid is coated, it is immediately hardened and patterned by the electron beam guns. Of course, if speed is not essential, only one electron beam gun can be used to perform both irradiations in turn.

The important ingredient in the process which must be available for feasibility is the polymerizable liquid. This material must not only be capable of converting from a liquid to a solid upon electron beam exposure at low dosage, but must also vaporize when exposed to a higher electron beam dose. Materials that exhibit this behavior include perfluorinated ethers.

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