Browse Prior Art Database

Thermal Compression Bond Lapping Cable

IP.com Disclosure Number: IPCOM000045918D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Robillard, WL: AUTHOR [+2]

Abstract

A snap-off cable is provided for bonding to a circuit for test purposes.

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Thermal Compression Bond Lapping Cable

A snap-off cable is provided for bonding to a circuit for test purposes.

A cable 10 having wires 11 plated on one side is employed for connection to a circuit for testing purposes. The cable is adapted to be bonded to the circuit by thermal compression (T.C.) and is serrated transversely (12) so that the bonded end may simply be snapped off upon completion of the testing process. The cable has a large number of serrations, making each of the small ends a snap-off consumable item.

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