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Browse Prior Art Database

Copper Texturing by Electrochemical Iodization

IP.com Disclosure Number: IPCOM000045945D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Cuomo, JJ: AUTHOR [+3]

Abstract

Smooth copper surfaces may be texture-etched, for improved adhesion of coatings, using an aqueous solution of 1MKI in an electrochemical bath.

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Copper Texturing by Electrochemical Iodization

Smooth copper surfaces may be texture-etched, for improved adhesion of coatings, using an aqueous solution of 1MKI in an electrochemical bath.

The figure demonstrates the apparatus. The copper-bearing item 1 is connected to the anode, and a platinum cathode 2 completes the electrical circuit through the potassium iodide plating solution.

The copper surface forms a highly textured layer of easily removable copper iodide. When the copper iodide layer is removed, the exposed copper surface is highly textured.

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