Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Electroplating Cell for Plating Vias

IP.com Disclosure Number: IPCOM000046025D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 3 page(s) / 64K

Publishing Venue

IBM

Related People

Bissinger, WDH: AUTHOR

Abstract

Baffles and an air sparger system are used to establish a laminar convection current in the electroplating solution flow on opposite sides of a multilayer printed circuit board (MLB) in an electroplating process for electroplating the walls of the MLB's vias.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 53% of the total text.

Page 1 of 3

Electroplating Cell for Plating Vias

Baffles and an air sparger system are used to establish a laminar convection current in the electroplating solution flow on opposite sides of a multilayer printed circuit board (MLB) in an electroplating process for electroplating the walls of the MLB's vias.

Schematically shown cell 10 has a pair of consumable anode plating electrodes 11 and 12, with the MLB mounted therebetween and configured as the common cathode plating electrode. The composition of electrodes 11 and 12 is compatible with the metal to be plated on the walls of the via openings H. The baffles 13 and 14 are located on opposite sides of the MLB, separating cell 10 into cathodic chamber 15 and anodic chambers 16 and 17. The baffles 13 and 14 have windows W covered with permeable diaphragm-like fabric members D for communication of the electrolyte 18 between the MLB and electrodes 11 and
12.

Electrolyte 18 is pumped into cell 10 near the bottom of chamber 15 through suitable downwardly focussed openings (not shown) of the electrolyte sparger conduit 19, circulating upwardly between baffles 13 and 14 and past the MLB. On the other sides of the baffles 13 and 14, the electrolyte flow reverses, i.e., the electrolyte 18 flows downwardly and is removed from cell 10 at the outlet ports 20 and 21 near the bottom of chambers 16 and 17, respectively. The electrolyte 18 when removed from cell 10 is processed through an external process system, not shown, which includes a buffer tank, filters, heat exchangers and other appropriate equipment, and recycled back into the electroplating tank T.

Aligned air bubble sparger conduits 22-24 are located near the bottom of chamber l5 through which filtered clean air is supplied. Each of the conduits 22- 24 has a plurality of openings (not shown) alternately arranged in two parallel rows and are focused downwardly...