Browse Prior Art Database

Blind Via Testing

IP.com Disclosure Number: IPCOM000046030D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fellows, CJ: AUTHOR [+4]

Abstract

The head of a pin is attached to the top of a blind via which is to be pull-tested for its bond or contact force with the surrounding material of a printed circuit laminate or board specimen in which it is located.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Blind Via Testing

The head of a pin is attached to the top of a blind via which is to be pull- tested for its bond or contact force with the surrounding material of a printed circuit laminate or board specimen in which it is located.

Pull testing of blind vias is described in *. The inverted and attached elongated pin, which is affixed by microwelding or any other suitable means, allows the attachment of a chuck to the pin stem for a more uniform distribution and control of the tensile pull force exerted on the via. The test may be performed in a cold pull mode, e.g., room temperature or, alternatively, in a hot pull mode. In the case of the latter, the heat is applied directly to the pin which in turn transfers it to the via and therethrough to soften the surrounding laminate or board material. Thus, the pin provides better and more uniform heat control than if the heat were to be applied directly to the top of the via and the laminate or board.

Reference

µ*Ù D. H. Strope and T. E. Wray, "Blind Via Quality Test," IBM Technical Disclosure Bulletin 25, 4744 (February 1983).

1