Browse Prior Art Database

Prevention of RF Shorting Caused by Corrosion Between Cathode and Anode Ground

IP.com Disclosure Number: IPCOM000046039D
Original Publication Date: 1983-May-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Petvai, SI: AUTHOR [+3]

Abstract

This article concerns an improved cooling system for use in cooling the target (cathode) of an RF sputtering system used, for example, to deposit quartz. The improved cooling system features use of an insulating barrier, such as a layer of TEFLON* or DELRIN* at the system cathode.

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Prevention of RF Shorting Caused by Corrosion Between Cathode and Anode Ground

This article concerns an improved cooling system for use in cooling the target (cathode) of an RF sputtering system used, for example, to deposit quartz. The improved cooling system features use of an insulating barrier, such as a layer of TEFLON* or DELRIN* at the system cathode.

In an RF sputtering system where the cathode is cooled, a corrosion potential may arise between the cathode inner cooling jacket made of copper and the cathode outer housing made of aluminum. Moisturegenerated by the cooling jacket water and condensation of water from the atmosphere causes a galvanic cell to be established between the copper and aluminum metals. Aluminum, being an amphoretic metal, will start to dissolve or corrode in a slightly acidic or slightly basic atmosphere. These corrosive products can cause severe erosion and eventual RF shorting in the sputtering system.

The corrosion potential can be overcome by using a shield of an inert plastic, for example, TEFLON or DELRIN, placed between the copper and aluminum of the cathode.

* Trademark of E. I. du Pont de Nemours & Co.

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