Browse Prior Art Database

Module Standoff

IP.com Disclosure Number: IPCOM000046189D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Darrow, RE: AUTHOR [+4]

Abstract

A design is proposed whereby the standoff between a circuit module and a printed circuit board can be molded from a suitable plastic material which is compatible with the module backseal operation and the solder and rework operations.

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Module Standoff

A design is proposed whereby the standoff between a circuit module and a printed circuit board can be molded from a suitable plastic material which is compatible with the module backseal operation and the solder and rework operations.

The standoff would slip over the I/O pin and seat down on the surface of the ceramic substrate without interfering with the module backsealing around the pin. This will eliminate standoff height variations and rocking conditions due to variations in the thickness of the backseal material. Flexible members are provided which contact the pins to allow for variations of pin diameter due to solder discontinuities. The standoff is designed to allow contact with only a small portion of the pin length, thereby not affecting the stiffness of the pin itself.

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