Browse Prior Art Database

Pinning Technique for Large Substrates

IP.com Disclosure Number: IPCOM000046191D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Darrow, RE: AUTHOR [+3]

Abstract

A general-purpose module (GPM) will combine a multilayer ceramic (MLC) substrate and a metallized ceramic (MC) top surface metallurgy. The MLC substrate will be relatively large and can vary in size. A low- cost pinning process is required for this type of module. The pinning process must be compatible with both MC and MLC and must be capable of pinning both pluggable and/or solderable substrates.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Pinning Technique for Large Substrates

A general-purpose module (GPM) will combine a multilayer ceramic (MLC) substrate and a metallized ceramic (MC) top surface metallurgy. The MLC substrate will be relatively large and can vary in size. A low- cost pinning process is required for this type of module. The pinning process must be compatible with both MC and MLC and must be capable of pinning both pluggable and/or solderable substrates.

It is proposed to make use of a segmented pin carrier process which uses four or more smaller prepinned pin carriers which are soldered to the bottom of the GPM substrate, as shown. The pin carriers are standard ceramic substrates which are pinned very economically using the standard MC pin swaging process. The pins can be either gold plated for pluggable modules or unplated for solderable modules.

A suitable solder paste would be applied to the bottom of the GPM substrate. The pin carriers would be fixtured into location, and the GPM substrate would be placed over them. The entire assembly is then passed through a reflow furnace to complete the connection.

1

Page 2 of 2

2

[This page contains 1 picture or other non-text object]