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Browse Prior Art Database

Prestressing Lamination Technique

IP.com Disclosure Number: IPCOM000046194D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Doran, DE: AUTHOR [+2]

Abstract

In the making of multilayer laminated printed circuit boards, it has been found that prestressing the copper during the lamination thereof to an epoxy glass laminate mitigates delamination therebetween during subsequent wave soldering processes.

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This is the abbreviated version, containing approximately 100% of the total text.

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Prestressing Lamination Technique

In the making of multilayer laminated printed circuit boards, it has been found that prestressing the copper during the lamination thereof to an epoxy glass laminate mitigates delamination therebetween during subsequent wave soldering processes.

One way to prestress the copper is to use planishing plates with a high thermal coefficient of expansion in the lamination process. For example, planishing plates of aluminum alloy Type 6061* have been used to prestress 5 oz. copper as it is being laminated to an epoxy glass laminate. It was found that the aluminum plates substantially mitigated subsequent delamination, much more so than in those cases when conventional stainless steel plates are used.

* Aluminum Association Standard System of Alloy Designation.

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