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Low Temperature, Low Cost Braze System for Electronic Packages

IP.com Disclosure Number: IPCOM000046203D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Brofman, PJ: AUTHOR

Abstract

A low temperature and low cost braze joint system has been developed that is suitable for joining metal to metallized ceramic packages. The braze joint system consists of a 38% Ag-33% Cu-29% In alloy jointed to nickel surfaces (plated, metallized or bulk).

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Low Temperature, Low Cost Braze System for Electronic Packages

A low temperature and low cost braze joint system has been developed that is suitable for joining metal to metallized ceramic packages. The braze joint system consists of a 38% Ag-33% Cu-29% In alloy jointed to nickel surfaces (plated, metallized or bulk).

The 38% Ag-33% Cu-29% In composition has a liquidus near 580OEC with a "mushy zone" (i.e., liquidus minus solidus) of about 15OEC. Thus, brazing occurs at about 610OEC. When the nickel surfaces are overplated with a flash of gold (e.g., 20 min. of gold), brazing can be performed in a hydrogen ambient without flux.

While the bulk 38% Ag-33% Cu29% In alloy is quite brittle, the Ag-Cu-In-Ni joint resulting from the brazing operation is quite strong and tough. The resultant joint may be used in both mechanical and hermetic applications.

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