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Repair Technique for Inter-Level Short

IP.com Disclosure Number: IPCOM000046211D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Flayter, GP: AUTHOR [+3]

Abstract

This article concerns a method for repairing inter-level shorts between two metal lines separated by a thin layer of dielectric film. The method can be applied to a package having thin film wiring where the bottom metallic line is part of a mesh pattern which is used as a ground or voltage plane and the upper line is part of a signal line or fan-out line. In accordance with this method, a focussed beam from a pulsed laser is used to isolate defects, such as shorts, between the signal line and the ground line.

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Repair Technique for Inter-Level Short

This article concerns a method for repairing inter-level shorts between two metal lines separated by a thin layer of dielectric film. The method can be applied to a package having thin film wiring where the bottom metallic line is part of a mesh pattern which is used as a ground or voltage plane and the upper line is part of a signal line or fan-out line. In accordance with this method, a focussed beam from a pulsed laser is used to isolate defects, such as shorts, between the signal line and the ground line.

The method of this article may be understood with reference to Figs. l and 2. Fig. l illustrates a short l0 between a segment of a signal line and a line l4 in a mesh pattern beneath a thin (5- to l0-micron) dielectric layer l6. The short is isolated by deleting ground line l4 through dielectric film l6 on both sides l8, 20 of the signal line, as best seen in Fig. 2. The deletion process, which takes place by rapid heating and evaporation of the metal, blows out a plug of the dielectric material over the deleted line. Since this line is part of a very dense mesh pattern connected to ground or a reference voltage, removal of small segments (tens of microns) is unlikely to affect its function. The signal line or fan-out line on top of the dielectric layer, however, is isolated from the mesh plane and becomes electrically operational.

The feasibility of this process has been demonstrated for both polyimide and glass dielec...