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Browse Prior Art Database

Method for the Electroless Production of Copper Foils

IP.com Disclosure Number: IPCOM000046229D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Junginger, R: AUTHOR [+3]

Abstract

By this method, an adhesion-promoting metal is sputtered on to a cleaned glass plate serving as a substrate. Subsequently, after activation of this metal layer, a highly adhesive, bubble-free copper foil, which is very smooth on the side facing the substrate, is deposited by electroless plating. This copper foil is removed from the substrate by diluted acid.

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Method for the Electroless Production of Copper Foils

By this method, an adhesion-promoting metal is sputtered on to a cleaned glass plate serving as a substrate. Subsequently, after activation of this metal layer, a highly adhesive, bubble-free copper foil, which is very smooth on the side facing the substrate, is deposited by electroless plating. This copper foil is removed from the substrate by diluted acid.

Example: A glass plate with a roughness O 0.l mm is degreased by several organic solvents, rinsed with deionized water, dried, and sputtered for further cleaning. Subsequently, an about 3O nm thick titanium or chromium layer is sputtered on to the substrate thus treated. For activating the metal layer, the substrate is immersed for l minute in 3 percent hydrochloric acid. Introduction of the substrate into the electroless copper plating bath is followed, if necessary, by a short cathodic polarization process to start the deposition of copper. After a copper foil of the desired thickness has been produced by electroless plating, the sample is taken from the bath and the foil is removed by treatment with semiconcentrated hydrochloric acid.

The foil thus obtained is free from dents and has a micro roughness of less than l mm on the substrate side. This foil is used to characterize the quality of copper deposited in electroless baths.

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